PTFE-impregnated fiberglass fabrics and PTFE adhesive tapes serve multiple key applications within the electronics sector, including wire and cable shielding protection, flexible circuit board thermal lamination, and low-friction slide liners for high-speed printing equipment.

Boasting a dense PTFE coating layer, our fiberglass composite materials feature robust abrasion resistance, superior non-stick performance, reliable electrical insulation and excellent high-temperature tolerance. Uncoated self-supporting PTFE fiberglass sheets work well as mold release separators, high-temperature transport belts and anti-friction lining components. Meanwhile, adhesive-backed PTFE tapes are widely adopted as insulating wrapping materials for RF coaxial cables and assorted electronic assemblies.

Our 0.05mm thin PTFE film tape is an essential wrapping material in RF cable production. The tape is wound onto cable cores at spaced overlapping intervals, effectively lowering the cable’s dielectric constant and signal attenuation values. After wrapping the PTFE film layer, copper foil strips are applied lengthwise and welded as the outer conductive shielding layer. The finished spiral wrapped structure delivers outstanding electromagnetic shielding while significantly boosting the cable’s bending flexibility.

Our customized wear-resistant PTFE fiberglass textiles are engineered to function as sliding bearing liners fitted inside high-speed printers. By minimizing surface friction, they enable steady, jam-free paper conveyance even after tens of thousands of operational cycles. This PTFE composite liner maintains stable physical performance under continuous operating temperatures reaching 180°C.

Thanks to its dual strengths of non-adhesive surface and dielectric insulation, PTFE coated glass cloth acts as both protective barrier and release sheet throughout flexible printed circuit (FPCB) manufacturing. The grade dedicated to circuit board lamination utilizes premium woven fiberglass saturated with thick PTFE coating, delivering an ultra-smooth, defect-free surface. It prevents surface blemishes from transferring onto circuit boards during hot pressing procedures and effectively lifts overall production throughput.